Process Parameters |
||
Description
|
Material
|
Spec
|
Dielectric Layer
|
Resin＋Conductive Filler
|
75um、80um、100um
125um、150um、200um
|
Circuit Layer
|
Copper Foil
|
17.5um、35um、70um、
105um
|
Solder Mask
|
Printing ink
|
Green、White、Black
|
Surface Finish
|
HASL LF
|
≤30um
|
OSP
|
0.2um~0.5um
|
|
Chemical Ni Au
|
Ni：2~9 um
Au：0.05um
|
|
Chemical Ag
|
0.5um~1.5um
|
|
Ni-Au plating
|
Ni：2~6 um
Au：0.025um
|
|
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