PCB TECHNICAL CAPABILITY |
|
Materials |
FR4、 CEM-3、Halogen free, High Frequency, Ceramics， Aluminum Base |
Lamination
|
Board Thickness: 0.1mm (Min.) - 4.5mm(Max. ) Max. Panel Size: 30”X21” (762mmx533mm) Max. Layer Count: 16L |
Drilling |
Drilled Hole Size: 0.2mm (Min.) Blind Vias: 0.2mm (Min.) Buried Vias: 0.2mm (Min.) Control Depth Drilling |
Line Width/Spacing
|
0.075mm/ 0.075mm（min.） |
Layer to Layer Registration
|
+/- 0.075mm (min.) |
Max Copper Thickness
|
6OZ （0.21mm） |
Surface Finishing
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HASL; Leadfree HASL; Flash gold; Gold finger Thick gold plating; Immersion gold / Silver / Tin ; OSP Multiple Surface Plating |
Fabrication
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Overall Dimensions Tolerance: +/-0.1mm (min.) Scoring, In-board Beveling, Beveling, Countersinking, Edge Milling |
Certifications
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ISO/TS16949:2009； ISO 9001:2008; ISO 14001:2004; UL Certificate; ROHS Compliance; REACH IPC-600， 6011/6012 |
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