MHE®301
Core Design Concept | Important Features & Cutting-edge Technology |
Metal Thermal Metal-based current carrying | Ultra low thermal resistance Large current carrying Maximize power device life Reduce substrate and radiator dimension Reduce the number of power devices or increase the power of a single power device |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 3.4 |
Copper foil (Oz) | 2 |
Surface finish | ENIPIG |
Solder mask color | Black |
Legend color | White |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 170 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 1.5 |
Copper foil (Oz) | 1 |
Surface finish | ENIG |
Solder mask color | Black |
Legend color | White |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 150 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 1.5 |
Copper foil (Oz) | 1 |
Surface finish | OSP |
Solder mask color | Green |
Legend color | White |
Thermal conductivity (W/m.k) | 230 |
Tg (°C) | 150 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper-aluminum composite base |
Layers | 1 |
Finished thickness (mm) | 1.5 |
Copper foil (Oz) | 2 |
Surface finish | OSP |
Solder mask color | White |
Legend color | Black |
Thermal conductivity (W/m.k) | 170 |
Tg (°C) | 150 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 1.0 |
Copper foil (Oz) | 1 |
Surface finish | ENIPIG |
Solder mask color | White |
Legend color | Black |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 140 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 1.2 |
Copper foil (Oz) | 1 |
Surface finish | ENIPIG、ENIG |
Solder mask color | White |
Legend color | Black |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 140 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 2 |
Finished thickness (mm) | 5.0 |
Copper foil (Oz) | 2 |
Surface finish | ENIG |
Solder mask color | White |
Legend color | / |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 150 |
MOT (°C) | 130 |
Type of structure | Imbeded Copper |
Layers | 1 |
Finished thickness (mm) | 1.5 |
Copperfoil(Oz) | 1 |
Surface finish | ENIG |
Solder mask color | Green |
Legend color | White |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 150 |
MOT (°C) | 130 |
Type of structure | Single Layer Copper Base |
Layers | 1 |
Finished thickness (mm) | 2 |
Copper foil (Oz) | 3 |
Surface finish | Immersion Tin |
Solder mask color | Green |
Legend color | White |
Thermal conductivity(W/m.k) | 398 |
Tg (°C) | 170 |
MOT (°C) | 130 |
Type of structure | Double Side Aluminium Substrate |
Layers | 2 |
Finished thickness (mm) | 1 |
Copperfoil(Oz) | 1 |
Surface finish | OSP |
Solder mask color | White |
Legend color | / |
Thermal conductivity (W/m.k) | 398 |
Tg (°C) | 150 |
MOT (°C) | 130 |
1. Does MHE®301 belongs to Metal Core PCB or not?
MHE®301, a unique member of MCPCB family, which is designed based upon the concept of direct metal conduction, is produced by special PCB manufacturing process and technology advantages. Due to its technology cutting-edge, the heat can be dissipated more efficiently.
2. What is the conventional thermal conductivity of MHE®301?
MHE®301 possesses a thermal conductivity of 400W/m.K and its thermal resistance is 0.100~0.638k/W.
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