MHE®301

Structure Diagram

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Technology Characteristics & Advantages

Core Design ConceptImportant Features & Cutting-edge Technology
Metal Thermal
Metal-based current carrying
Ultra low thermal resistance
Large current carrying
Maximize power device life
Reduce substrate and radiator dimension
Reduce the number of power devices or increase the power of a single power device

Application field

Medical Devices
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)3.4
Copper foil (Oz)2
Surface finishENIPIG
Solder mask colorBlack
Legend colorWhite
Thermal conductivity (W/m.k)398
Tg  (°C)170
MOT (°C)130
Automotive electronics
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)1.5
Copper foil (Oz)1
Surface finish ENIG
Solder mask colorBlack
Legend color White
Thermal conductivity  (W/m.k)398
Tg  (°C)150
MOT (°C)130
Automotive electronics
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)1.5
Copper foil (Oz)1
Surface finish OSP
Solder mask colorGreen
Legend color White
Thermal conductivity  (W/m.k)230
Tg  (°C)150
MOT (°C)130
ZoomElectric power supply
Type of structure

Single Layer

Copper-aluminum

composite base

Layers1
Finished thickness  (mm)1.5
Copper foil (Oz)2
Surface finish OSP
Solder mask colorWhite
Legend color Black
Thermal conductivity  (W/m.k)170
Tg  (°C)150
MOT (°C)130
ZoomElectric Torch
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)1.0
Copper foil (Oz)1
Surface finish ENIPIG
Solder mask colorWhite
Legend color Black
Thermal conductivity  (W/m.k)398
Tg  (°C)140
MOT (°C)130
Zoom High Bay
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)1.2
Copper foil (Oz)1
Surface finish ENIPIG、ENIG
Solder mask colorWhite
Legend color Black
Thermal conductivity  (W/m.k)398
Tg  (°C)140
MOT (°C)130
ZoomLaser Projector
Type of structure

Single Layer

Copper Base

Layers2
Finished thickness  (mm)5.0
Copper foil (Oz)2
Surface finish ENIG
Solder mask colorWhite
Legend color /
Thermal conductivity  (W/m.k)398
Tg  (°C)150
MOT (°C)130
Zoom Power Module
Type of structure

Imbeded

Copper

Layers1
Finished thickness  (mm)1.5
Copperfoil(Oz)1
Surface finish ENIG
Solder mask colorGreen
Legend color White
Thermal conductivity  (W/m.k)398
Tg  (°C)150
MOT (°C)130
ZoomElectric power supply
Type of structure

Single Layer

Copper Base

Layers1
Finished thickness  (mm)2
Copper foil (Oz)3
Surface finish Immersion Tin
Solder mask colorGreen
Legend color White
Thermal conductivity(W/m.k)398
Tg  (°C)170
MOT (°C)130
Zoom Automotive electronics
Type of structure

Double Side

Aluminium Substrate

Layers2
Finished thickness  (mm)1
Copperfoil(Oz)1
Surface finish OSP
Solder mask colorWhite
Legend color /
Thermal conductivity  (W/m.k)398
Tg  (°C)150
MOT (°C)130

FAQ

  • 1. Does MHE®301 belongs to Metal Core PCB or not?

    MHE®301, a unique member of MCPCB family, which is designed based upon the concept of direct metal conduction, is produced by special PCB manufacturing process and technology advantages. Due to its technology cutting-edge, the heat can be dissipated more efficiently.

  • 2. What is the conventional thermal conductivity of MHE®301?

    MHE®301 possesses a thermal conductivity of 400W/m.K and its thermal resistance is 0.100~0.638k/W.

0.0458s