Process Capability--Rayben

Process project	FR4	MCPCB	MHE® 301	MHE® 601	MHE® 901
Max Layers	10L	2L	4L	2L	6L
Max finish thickness	4.0mm	3.2mm	3.0mm	1.25mm	2.0mm
Min finish thickness	0.20mm	0.6mm	0.6mm	0.90mm	0.75mm
Min dielectric thickness	0.05mm	0.038mm	0.075mm	0.075mm	/
Dielectric Thermal Conductivity	/	1-8W/m.K	1-8W/m.K	/	/
Inner layer copper thickness	1/3-6 OZ	1-4 OZ	1/2-6 OZ	1/2-2 OZ	1/2-4 OZ
Outer layer copper thickness	1/3-6 OZ	1-4 OZ	1/2-6 OZ	1/2-2 OZ	1/2-4 OZ
Min inner layer line width/spacing	0.075/0.075mm	0.127/0.127mm	0.1/0.1mm	0.1/0.1mm	0.1/0.1mm
Min outer layer line width/spacing	0.09/0.09mm	0.127/0.127mm	0.127/0.127mm	0.1/0.1mm	0.15/0.15mm
Min mechanical drilling diameter	0.15mm	0.70mm	0.70mm	0.70mm	0.15mm
Min laser drilling diameter	0.1mm	/	/	/	/
Max mechanical hole aspect ratio	10：1	/	/	/	10：1
Max laser blind hole aspect ratio	1：1	/	/	/	/
Press fit hole diameter tolerance	±0.05mm	/	/	/	±0.05mm
Min single line impedance tolerance	±10%	/	/	/	±10%
Min differential Impedance tolerance	±8%	/	/	/	±8%
Min solder mask bridge width	0.06mm	0.075mm	/	/	0.075mm
Min solder mask window	0.038mm	0.05mm	/	/	0.05mm
Min BGA PAD diameter	0.2mm	/	/	/	/
Min BGA Pitch	0.45mm	/	/	/	/
Hole to hole tolerance	±0.050mm	±0.050mm	±0.050mm	±0.050mm	±0.050mm
Hole to PAD tolerance	±0.050mm	±0.050mm	±0.050mm	±0.050mm	±0.050mm
Hole to breakage tolerance	±0.050mm	±0.050mm	±0.050mm	±0.050mm	±0.050mm
PAD to breakage tolerance	±0.050mm	±0.050mm	±0.050mm	±0.050mm	±0.050mm
Max height difference of thermal PAD to around solder pad	/	/	0.010mm	/	0.005mm
Min spacing of thermal pad to around solder pad	/	/	0.25mm	/	/
Routing depth tolerance	±0.025mm	±0.025mm	±0.025mm	/	±0.025mm
Surface finish	OSP、ENIG、ENIPIG、Immersion Sn、HASL lead-free	OSP、ENIG、ENIPIG、Immersion Sn、HASL lead-free	OSP、ENIG、ENIPIG、Immersion Sn	ENIPIG	OSP、ENIG、ENIPIG、Immersion Sn、Immersion Ag