Process Capability

Process projectFR4MCPCBMHE® 301MHE® 601MHE® 901
Max Layers10L2L4L2L6L
Max finish thickness4.0mm3.2mm3.0mm1.25mm2.0mm
Min finish thickness0.20mm0.6mm0.6mm0.90mm0.75mm
Min dielectric thickness0.05mm0.038mm0.075mm0.075mm/
Dielectric Thermal Conductivity/1-8W/m.K 1-8W/m.K //
Inner layer copper thickness1/3-6   OZ1-4   OZ1/2-6   OZ1/2-2   OZ1/2-4   OZ
Outer layer copper thickness1/3-6   OZ1-4   OZ1/2-6   OZ1/2-2   OZ1/2-4   OZ
Min inner layer line width/spacing0.075/0.075mm0.127/0.127mm0.1/0.1mm0.1/0.1mm0.1/0.1mm
Min outer layer line width/spacing0.09/0.09mm0.127/0.127mm0.127/0.127mm0.1/0.1mm0.15/0.15mm
Min mechanical drilling diameter0.15mm0.70mm0.70mm0.70mm0.15mm
Min laser drilling diameter0.1mm////
Max mechanical hole aspect ratio10:1///10:1
Max laser blind hole aspect ratio1:1////
Press fit hole diameter tolerance±0.05mm///±0.05mm
Min single line impedance tolerance±10%///±10%
Min differential Impedance tolerance±8%///±8%
Min solder mask bridge width0.06mm0.075mm//0.075mm
Min solder mask window0.038mm0.05mm//0.05mm
Min BGA PAD diameter0.2mm////
Min BGA Pitch0.45mm////
Hole to hole tolerance±0.050mm±0.050mm±0.050mm±0.050mm±0.050mm
Hole to PAD tolerance±0.050mm±0.050mm±0.050mm±0.050mm±0.050mm
Hole to breakage tolerance±0.050mm±0.050mm±0.050mm±0.050mm±0.050mm
PAD to breakage tolerance±0.050mm±0.050mm±0.050mm±0.050mm±0.050mm

Max height difference of

thermal PAD to around

solder pad

//0.010mm/0.005mm

Min spacing of thermal pad

to around solder pad

//0.25mm//
Routing depth tolerance±0.025mm±0.025mm±0.025mm/±0.025mm
Surface finishOSP、ENIG、ENIPIG、Immersion Sn、HASL lead-freeOSP、ENIG、ENIPIG、Immersion Sn、HASL lead-freeOSP、ENIG、ENIPIG、Immersion SnENIPIGOSP、ENIG、ENIPIG、Immersion Sn、Immersion Ag
0.0412s