1. Making micro heat exchanger with high thermalconductivity materials.

    2. Forming composite structure by embedded micro heat exchanger in conventional FR4 PCBs.

    1. With high thermal conductivity and insulativity characteristics of ceramics or high thermal conductivity and high current carrying characteristics of copper.

    2. With machinability and assembly characteristics of FR4 material

    3. Achieve continuous and compact wiring design,saving space.

    4. Streamline module structure to achieve efficient assembly of modules and reduce total cost.

    5. Reduce the number of power devices or increase the power of a single power device