MHE®901

Structure Diagram

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Technology Characteristics & Advantages

   

Core Design ConceptImportant Features & Cutting-edge Technology
  •     1. Making micro heat exchanger with high thermalconductivity materials.

  •     2. Forming composite structure by embedded micro heat exchanger in conventional FR4 PCBs.

  •     1. With high thermal conductivity and insulativity characteristics of ceramics or high thermal conductivity and high current carrying characteristics of copper.

  •     2. With machinability and assembly characteristics of FR4 material

  •     3. Achieve continuous and compact wiring design,saving space.

  •     4. Streamline module structure to achieve efficient assembly of modules and reduce total cost.

  •     5. Reduce the number of power devices or increase the power of a single power device

Application fields

Automotive electronics
Layers4
MHE Material and Dimension(mm)ALN/7*7
Finished thickness  (mm)1.64
Copper foil (Oz)2
Surface finish ENIG
Solder mask colorWhite 
Legend color /
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)15KV
Automotive electronics
Layers4
MHE Material and Dimension(mm)ALN/7*7
Finished thickness  (mm)1.64
Copper foil (Oz)2
Surface finish ENIG
Solder mask colorWhite
Legend color/
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)15KV
Electric power supply
Layers1
MHE Material and Dimension(mm)ALN/10*10
Finished thickness  (mm)3.6
Copper foil (Oz)2
Surface finish OSP
Solder mask colorGreen
Legend color /
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)5KV
Electric power supply 
Layers1
MHE Material and Dimension(mm)ALN/10*10
Finished thickness  (mm)3.25
Copper foil (Oz)2
Surface finish ENIG
Solder mask colorGreen
Legend color Green
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)5KV
ZoomPAR
Layers2
MHE Material and Dimension(mm)ALN/7*7
Finished thickness  (mm)1.1
Copper foil (Oz)1
Surface finish ENIG
Solder mask colorWhite
Legend color Black
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)3KV
ZoomDownlight
Layers2
MHE Material and Dimension(mm)ALN/7*7
Finished thickness  (mm)1.6
Copper foil (Oz)1
Surface finish ENIPIG
Solder mask colorWhite
Legend color Black
Thermal conductivity  (W/m.k)170
Breakdown voltage (DC)3KV
ZoomAutomotive electronics
Layers4
MHE Material and Dimension(mm)Copper/10*10
Finished thickness (mm)1.6
Copper foil (Oz)1
Surface finishENIG
Solder mask colorGreen
Legend color White
Thermal conductivity  (W/m.k)398
Breakdown voltage (DC)15KV

FAQ

  • 1.What’s the voltage resistance of MHE®901?

    The voltage resistance of MHE®901 can up to 15KVDC/mm.

  • 2.What is the regular peeling strength of MHE®901?

    Rayben can promise that the peeling strength is ≥ 1.05N/mm.

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